Press Releases of InfraTec

Our free of charge “Thermografie-Awenderkonferenz” (thermography user conference) on November 5, 2026 provides a forum for professional exchange among users from academia and industry, with a particular focus on applications of thermography for demanding tasks in research and development.

On November 10, 2026, we invite you to join our free of charge online event, “AI-powered Thermal Data Processing”. Learn more about the use of artificial intelligence to extract and analyze valuable data from thermographic measurements.

Our free of charge InfraTec English online event "Infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits" will provide you with more information about lock-in thermography as a high-precision measurement method for non-contact and non-destructive testing in electronics and electrical engineering.

As part of the IGF project “Manufacture of high-strength, ductile components from low-alloy quenched and tempered steel using novel quenching & partitioning press hardening strategies”, infrared thermography was used for process analysis and material characterization. The work focused on thermomechanical interactions during forming. Thermographic measurements were taken both during conventional heating processes (for example, furnace heating) and during innovative strategies such as contact heating.

With InfraTec’s new DIECAST-CHECK automation solution, users can monitor the temperature distribution across the surface of the die inline. The system detects thermal deviations early on, thereby creating the conditions necessary to stabilize die casting processes, reliably ensure the quality of castings, and reduce scrap.